Opto - Packaging

Assembling

• Assembling of dies or chip on submount (cos)
• packaging at TO header (TO41 to TO3), ceram, printed circuit board, others
• assembling of thermistor, TEC's, submounts
• diebonding: manual; automatic TO46, TO41
• wirebonding: manual (Au, Al); automatic (Au, Al)
• encapsulation: capwelding (N₂, mix); capbonding (hermetically)
• optical covering, using of special optical materials
• optical measurement

Fiber Coupling

• active alignement of LED, LD, ELED, QCL, PD, APD
• fibre: MM, SM, SM-PM, POF
• devices: pigtail, receptacle, TOSA-ROSA, module
• technologies: glueing, laserwelding (manual, automatic)

Optical modules

• design and assembling of optical transmitter and receiver modules
• hermetical sealed devices as DIL, butterfly, HHL; customer specific outline
• fibercoupling, thermal management (NTC, TEC), optical components involved

Advanced termination of fibre optics

• special ferrules/ connectors for fibres (SM, MM, HCS, POF)
• handling of special cables and fibres

Passive Components

• Assembling of customer specific fibre collimators
• Components for Expanded Beam Connections

Design und development

• Costumer specific TO devices (PIN-TIA e.g.)
• Submodules and modules (sensors, medicin, LAN, e.g.)
• Complete development process: design - samples - qualification - serial production
• Study of feasibility, projectmanagement, qualification of prototypes

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