Hybrid Assembly

Pick and place

• Epoxy
• Soldering

Die attach

• Epoxy
• Soldering

Wire bonding(20-50µm wire)

• Ultrasonic with Al-wire
• Thermosonic with Au-wire

Encapsulation

• Glob Top (Epoxy, Silicone)
• Hermetic seal

Substrate / carrier

• Ceramic
• Cicuit board
• Flex
• Metal can (TO-46 for example)

Special features

• Plasma cleaning
• Pull test
• BSOB (ball stitch on ball)
• Thermode soldering

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