Overview film technologies
Technology
Gold fine line
Thick film
Substrates
Material
aluminium oxide (Al2O3)
aluminium oxide (Al2O3), aluminium nitride (AlN)
Surface
glazed
as-fired / lapped
Max. dimension
128 x 40 mm2
128 x 76mm2
Thickness
standard: 1mm
0,17 - 1,5mm
Conductors
Material
Au
Au
Ag
AgPd
AgPt
Sheet resistance
< 70 m
1
14 m
2 m2
23 - 30 m
2 - 4 m
Wire bondability
Au
Au, Al
Au
Linewidth
≥ 20 µm
≥ 80 µm
Spacing
≥ 20 µm
≥ 100 µm
Thickness
0,3 – 0,5 µm
2 – 25 µm
Non - conducting layers
Insulator
Overglaze
Overglaze
Technological features
Gold fine line technology on glazed ceramic
Photolithogrphie and chemical etching
Screen printung technology for backside und edge metallization
Direct writing with MicroPen technology
Polymer technology on request
Photolithogrphie and chemical etching
Screen printung technology for backside und edge metallization
Direct writing with MicroPen technology
Polymer technology on request
1 0,5µm thickness
2 Max. electrical current: 1 A at cross-section 100 x 10 µm2
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